SR3595D IC
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Product Details
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UNISOC SR3595D 4G LTE RF TRANSCEIVER IC DETAILED REWORK GUIDE
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1. FUNCTIONAL ARCHITECTURE & CIRCUIT ROLE:
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- Dual-Path Heterodyne RF Conversion:
* The SR3595D handles both transmission (Tx) and reception (Rx) across all mainstream global cellular bands
(LTE-FDD, LTE-TDD, WCDMA, and GSM/GPRS/EDGE).
* Receive Path (Rx): Cellular radio waves captured by the antenna pass through the front-end module (FEM)
and bandpass SAW filters into SR3595D. The chip uses internal low-noise amplifiers (LNAs) and quadrature
mixers to down-convert high frequencies into analog baseband I/Q signals for the modem.
* Transmit Path (Tx): Analog I/Q signals from the baseband processor are filtered, modulated, and up-converted
to target RF carrier frequencies before being routed to external Power Amplifiers (PA) for transmission.
- Phase-Locked Loop (PLL) & System Clock:
* Contains an integrated fractional-N synthesizer, local oscillators (VCOs), and interfaces with the
main 26MHz reference crystal oscillator (TCXO/VCTCXO) to ensure frequency stability.
- Power Supply Architecture:
* Powered by multiple clean, low-noise LDO power rails (typically 1.2V core logic, 1.8V analog/I/O, and
2.8V RF analog) supplied directly by the primary PMIC (e.g., UMP510G / SC2720 / SC2723).
2. BOARD-LEVEL FAULT SYMPTOMS (خرابی کی نشانیاں):
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- No Service / Searching (نو سروس یا سگنل سرچنگ پر اٹک جانا):
* Antenna bars show circle with a slash (⊘) or remain permanently stuck on "Searching...", even though
Baseband Version and IMEI are intact in device settings.
- Emergency Calls Only (صرف ایمرجنسی کالز):
* The phone detects SIM card identity but fails to register with the mobile network operator tower.
- 2G Works, but No 4G / LTE (صرف 2G آنا اور 4G نہ چلنا):
* Manual network search shows 2G networks, but fails to display or connect to 4G LTE operators due to
damaged LTE mixer or internal synthesizer block.
- Instant Signal Drop During Voice Calls:
* Signal bars drop to zero the instant a phone call is dialed or received (Tx power transmission circuit failure).
- Network Power Rail Short to Ground:
* Puncture of internal LDO input transistors shorts the 1.8V or 2.8V RF power rail to ground, causing
excessive battery drain and overheating in the network shielding compartment.
3. STEP-BY-STEP MULTIMETER TESTING & DIAGNOSTICS:
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A. Cold Testing (Diode Mode Check - Battery Disconnected):
1. Place Multimeter in Diode Mode. Connect RED probe to PCB Ground (Shielding frame), test with
BLACK probe around SR3595D bypass capacitors:
- VDD_RF_1V8 Power Rail Capacitors: Normal ~420mV – 540mV (0.000V = dead short).
- VDD_RF_2V8 Analog Rail Capacitors: Normal ~500mV – 650mV.
- VDD_DIG_1V2 Core Digital Rail: Normal ~300mV – 420mV.
- 26MHz Clock Input Line: Normal ~550mV – 700mV.
- Baseband I/Q Differential Signal Lines: Normal ~450mV – 600mV (pairs must match within ±15mV).
2. Short-Circuit Isolation:
- If any RF rail reads 0.000V, remove the parallel bypass capacitors first; if short persists, lift SR3595D.
B. Hot Testing (Phone Powered On with SIM Card Inserted):
1. Power up motherboard and open Network Settings:
- Check 26MHz Clock input pad: Verify stable 26.000MHz sinusoidal clock oscillation via oscilloscope
or frequency counter.
- Measure power supply capacitors: Confirm steady 1.2V, 1.8V, and 2.8V DC rails are actively delivered
by the PMIC during network registration.
- If all supply voltages and 26MHz clock are present and verified, but network search yields zero
operators, SR3595D is defective and must be replaced.
4. SOLDERING, REBALLING & REWORK SPECIFICATIONS:
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- RF Shielding Can Removal:
* SR3595D is located inside the RF network shielding compartment. Remove the shield using hot air at
340°C–350°C with shielding tape applied to nearby plastic SIM trays, cameras, and CPU.
- IC Desoldering:
* Apply high-grade, non-corrosive RMA tacky flux around the perimeter of SR3595D.
* Hot air rework parameters: Temperature 330°C – 345°C, airflow 30% – 35% with a fine-tip nozzle.
* Heat in uniform circular motion for 15–20 seconds. Touch gently with precision tweezers; once the
solder balls melt, lift straight up without dragging across PCB pads.
- Motherboard Pad Cleaning:
* Apply 183°C (Sn63/Pb37) leaded solder to blend with factory high-melt unleaded alloy.
* Flatten motherboard micro-pads using fine copper desoldering braid and a micro-tip soldering iron
at 280°C – 290°C.
* Clean thoroughly with 99% pure Isopropyl Alcohol (IPA); inspect under a microscope to confirm no
bridging or missing traces.
- Reballing Procedure:
* Secure a dedicated UNISOC SR3595D stencil or universal 0.35mm/0.4mm pitch BGA stencil.
* Spread 183°C fine-grain leaded solder paste smoothly into all stencil apertures.
* Heat with hot air set to 280°C with low airflow (15%–20%) until bright, uniform solder spheres form.
- Placement & Final Reflow:
* Apply a micro-thin layer of tacky flux across the PCB footprint.
* Align the Pin 1 index dot precisely with the motherboard silkscreen guide.
* Reflow at 305°C – 315°C with 30% airflow; the chip will automatically pull into center alignment via
molten solder surface tension.
* Allow motherboard to cool naturally for 3–5 minutes before installing SIM card and testing cellular network.
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